MECHANIC Heat Kit Smart Reflow Soldering Heating Platform

Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform With Stencil For iPhone 11-13Pro Max Motherboard Layered Welding

Features:

• Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation

• Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow

• The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance

• 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily

• 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode

• Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat

• Monitor temperature changes and realize reflow soldering temperature curve data monitoring

• Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view

• Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max

Key Description:

• “Add button” click to adjust the temperature, long press to start heating

• “Minus key” click to adjust the temperature, long press to start cooling

• “MEM key” click to switch three temperature memory, long press to set the memory temperature

• “SET button” click to switch five modes, long press to set the mode temperature

Package includes:

• 1 x Host

• 1 x Power Cord

• 6 x Modules

• 12 x Steel mesh