ACE SMT Solder Paste SN63PB37

SMD SMT Solder Paste SN63Pb37 High Precision No-Clean Soldering Paste for PCB Rework & Assembly

Achieve strong, reliable solder joints with the SMT Solder Paste SN63Pb37, a premium quality no-clean solder paste designed for high-precision PCB assembly and rework applications. Formulated with a eutectic alloy composition of 63% Tin (Sn) and 37% Lead (Pb), this solder paste delivers excellent wettability, low residue, and consistent performance for both manual and automated surface mount technology (SMT) processes.

Key Features:

• Eutectic Alloy Composition (Sn63/Pb37): Melts precisely at 183C for smooth, quick, and stable soldering with minimal bridging.

• No-Clean Flux Type: Leaves low-residue post-soldering, eliminating the need for cleaning in most applications.

• High Printability: Optimized viscosity for stencil printing and syringe dispensing with minimal slump or clogging.

• Superior Wetting & Joint Strength: Ensures durable electrical connections across various component sizes and PCB types.

• Long Working Time: Maintains reflow and print quality over extended production cycles.

• Packaging Options: Available in convenient syringes and jars suitable for DIY enthusiasts, prototyping, or production lines.

Applications:

• Surface mount device (SMD) assembly

• PCB rework and repair

• DIY electronics kits

• BGA, QFN, and fine-pitch components

Specifications:

• Alloy Composition: 63% Tin, 37% Lead (Sn63Pb37)

• Melting Point: 183C

• Flux Type: No-Clean

• Particle Size: 2545m (Type 3)

• Shelf Life: 612 months when refrigerated (010C)

Whether you’re working on professional electronics manufacturing or small-scale DIY soldering projects, this SMT SN63Pb37 solder paste ensures consistent, high-quality results every time.